EPOXIDUR^®

Our epoxy resin moulding compounds have excellent properties for the highest demands. The coefficient of linear expansion (CTE) can be individually adjusted to your requirements in the range from 15 to 30 ppm. The products have excellent adhesion and thus media tightness to many substrates such as lead frames, PCB solder masks or even EPOXIDUR® pre-mouldings.

 

Their excellent resistance to many fluids and chemicals makes them particularly suitable for use in the automotive sector. The chemical resistance is given with many aggressive fluids, for example in the brake fluid DOT 4, all types of (bio)fuels as well as transmission fluids / ATF (ZF Lifeguard 8, Shell L 12108). The moulding compounds have an autoclave resistance of 3000 cycles at 137 °C.  They also have a high thermal conductivity of up to 10 W/m*K while maintaining full electrical insulation. The temperature resistance of the encapsulated electronics is -60 to 175 °C at 3000 temperature cycles. The high dielectric strength of up to 60kV also allows very thin insulation thicknesses to be used. Due to the excellent mechanical and thermomechanical properties, crack resistance is still guaranteed.

 

We attach great importance to be conform with material compliance requirements, which we take into account constantly from development to serial production. In this way, we ensure that EPOXIDUR® materials meet all standards, do not contain any prohibited or declarable ingredients and are free from any hazardous substance labelling.

 

Our moulding compounds are approved for use in electrical insulation systems according to UL 1446 insulation class H / >180°C and are used in many corresponding applications. The continuous operating temperature is up to 210°C (20,000 hours) according to IEC 60216/T-1. UL Yellow Cards with UL94-V0 classifications are also possible. The products meet the ATEX requirements of electrical systems. They are biocompatible according to EN ISO 10993-5 (cytotox test).